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IEEE-NEMS 2015 <> Plenary Talks

Plenary Talks

Plenary Lecture 1: Bio Cell Analysis and Assembly by Micro and Nano Robotic Technology

Toshio Fukudafukuda2
Beijing Institute of Technology, China
Nagoya University, Meijo University, Japan

Abstract: Micro-nano robotic technology nowadays has a solid discipline, as synergetic integration of the micro and nano sensor, actuator, control, computer and material, and wide spread applications to industry and consumer in our daily life. Micro-nano fabrication, materials, assembly with evaluation leads downsizing of the products and give more economical material and energy efficiency, and more functions from the viewpoints of Green and Life innovations.
This micro-nano robotic technology can also show to give a new dimension of theory and applications in the life science, such as medical engineering, bio-engineering, bio-robotics and other areas. In particular, more active observation with micro-nano robotic manipulation has been more popular, leading new discovery and finding in bio cell analysis as well as improving the quality of life. Then it is challenging to investigate how we can construct a 3 D bio cell assembly by the synthesis approach based on the knowledge and findings of the bio cell analysis. There will be several methods to achieve this challenge. In this paper, we show some of the unique assembly methods by the DEP, hydro gel fibers and so on.

Biography: Toshio Fukuda graduated from Waseda University, Tokyo, Japan in 1971 and received the Master of Engineering degree and the Doctor of Engineering degree both from the University of Tokyo, in 1973 and 1977, respectively, after studying at Yale in 1973-1975. He joined the National Mechanical Engineering Laboratory in Japan and also worked at the University of Stuttgart as a research Scientist. He joined the Science University of Tokyo in 1981, and then joined Department of Mechanical Engineering, Nagoya University, Japan in 1989. Currently he is the professor of Beijing Institute of Technology and Nagoya/Meijo University. He was President of IEEE Robotics& Automation Society (1998-1999), IEEE Director Division X Systems & Control (2001-2002), Founding President of IEEE Nanotechnology Council (2002-2005), Editor-In-Chief, IEEE/ASME Trans. Mechatronics (2000-2012), IEEE Region 10 Director (2013-2014). He is EiC J. Robomech from Springer (2013-), a member of the Science Council of Japan (2008-2014) and a member of the Academy of Engineering of Japan (2013-).


Plenary Lecture 2: Research of MEMS/Nanotechnology in XJTU-IPENG

Zhuangde Jiangzhuang
Xi’an Jiaotong University, China

Abstract: This talk presents the research in MEMS/Nanotechnology field carried out at Institute of Precision Engineering (IPENG) of Xi’an Jiaotong University, mainly focusing on MEMS sensors and relevant technologies. Based on MEMS structure and mask layout design, different types of sensors have developed such as MEMS pressure sensor, accelerometer and integrated sensors etc. Especially, the theories of SOI technology and piezoresistive sensing principle are investigated, and then a series of pressure sensors for various applications are fabricated, including high temperature pressure sensor, micro pressure sensor, and ultra high range pressure sensor. In addition, other relevant MEMS devices are introduced, such as microfluidic, biosensor etc. Finally, some research on nanotechnology carried out in IPENG is also discussed, including nano-metrology, measurement and characterization of nano-structures, and even nano-devices.

Biography: Dr. Zhuangde Jiang, a member of Chinese Academy of Engineering, a professor of Xi’an Jiaotong University of China, and a visiting professorial fellow of the University of New South Wales of Australia. He was the vice president of Xi’an Jiaotong University. Now he is the president of Shaanxi Association for Science and Technology, and the director of Institute of Precision Engineering at Xi’an Jiaotong University. He also holds some important academic posts, such as the vice director-general of Chinese Society of Micro-Nano Technology, the vice director-general of China Machinery Industry Education Association, the executive member of Chinese Mechanical Engineering Society (CMES), the executive member of Chinese Society for Measurement, the director-general of Shaanxi Province Mechanical Engineering Society, etc. He keeps research on micro- /nano-manufacturing, precision measurement technology and relevant basic theories. He has achieved one award of National Technological Innovation, one award of National Science and Technology Progress, and the other 7 provincial awards. He also achieved the Science and Technology Awards of the Ho Leung Ho Lee Foundation in 2014. Under his supervision, more than 100 PhD and postgraduates students graduated. He has edited 2 books, published more than 300 academic papers, been granted 80 authorized invention patents and 15 software copyrights.


Plenary Lecture 3: 3D Nanomembrane Architectures

Oliver G. Schmidtoliver2

Leibniz Institute for Solid State and Materials Research, Germany

Abstract: Nanomembranes are thin, flexible, transferable and can be shaped into 3D micro- and nanoarchitectures. This makes them attractive for a broad range of applications and scientific research fields ranging from novel hybrid heterostructure devices to ultra-compact 3D systems both on and off the chip. If nanomembranes are differentially strained they deform themselves and roll-up into tubular structures upon release from their mother substrate. Rolled-up nanomembranes can be exploited to rigorously compact electronic circuitry, energy storage units and novel optical systems.
If appropriate materials are chosen, rolled-up tubes act as tiny catalytic jet engines which in the ultimate limit may drive compact multifunctional autonomous systems for medical and environmental applications. If magnetic tubes are combined with flagella-driven sperm cells, such hybrid micro-biorobots offer new perspectives towards artificial reproduction technologies.

Biography: Oliver G. Schmidt is a Director at the Leibniz Institute for Solid State and Materials Research Dresden, Germany, and holds a full Professorship for Material Systems for Nanoelectronics at the Chemnitz University of Technology, Germany. His scientific activities concentrate on inorganic nanomembrane materials and bridge across interdisciplinary research fields, ranging from magnetoelectronics and nanophotonics to energy storage and microrobotics. He has received several awards: the Otto-Hahn Medal from the Max-Planck- Society in 2000, the Philip- Morris Research Award in 2002 and the Carus-Medal from the German Academy of Natural Scientists Leopoldina in 2005.
Most recently, he received the International Dresden Barkhausen Award 2013 for his work on “Materials, Architectures and Integration of Nanomembranes”.


Plenary Lecture 4: Integration of MEMS and IC based on Wafer Bonding Technology

Shuji Tanakashuji2
Tohoku University, Japan

Abstract: The comfort of user interface and the dependability of wireless communication are key factors to determine the value of ownership for mobile information systems. Such functions heavily depend on microelectromechanical components and functional materials. Recently, we have developed several types of heterogeneous integration technology based on wafer bonding. The core idea is that heterogeneous components or materials, which cannot be directly formed on a device wafer, are bonded or transferred to device wafers.
An integrated network tactile sensor was developed for covering the whole body of a partner robot. A capacitive force sensor is bonded on a laboratory-designed ASIC by adhesive polymer. A novel through-silicon groove structure is fabricated in the ASIC to form contact pads on the backside of the ASIC, which allows the chip-size packaged sensor to be directly mounted on a flexible circuit.
An integrated acoustic wave oscillator provides on-chip frequency standard and selection for advanced communication, accurate analog-to-digital conversion etc. Film bulk acoustic resonators, surface acoustic wave resonators were integrated with sustaining amplifiers by selective wafer-to-wafer transfer of dies.
A PZT-actuated MEMS switch was also integrated with a CMOS circuit. The deposition temperature of PZT is as high as 600°C, at which a standard CMOS circuit cannot survive. Therefore, a PZT film deposited and patterned on a Si wafer was transferred to the CMOS wafer by wafer bonding. A similar transfer technology was applied to a diamond film to make an electrochemical biosensor array.

Biography: Shuji Tanaka received B.E., M.E. and Dr.E. degrees in mechanical engineering from The University of Tokyo in 1994, 1996 and 1999, respectively. He was Research Associate at Department of Mechatronics and Precision Engineering, Tohoku University from 1999 to 2001, Assistant Professor from 2001 to 2003, and Associate Professor at Department of Nanomechanics from 2003 to 2013. He is currently Professor at Department of Bioengineering and Robotics, and Director of Micro/Nano-Machining Research & Education Center. He was also Fellow of Center for Research and Development Strategy, Japan Science and Technology Agency from 2004 to 2006, and is currently Selected Fellow. He authored 350 journal and international conference papers and delivered 100 invited talks. He was honored with The Young Scientists’ Prize, The Commendation for Science and Technology by the Minister of Education, Culture, Sports, Science and Technology (2009), German Innovation Award, Gottfried Wagener Prize (2012) and other 8 prizes. His research interests include heterogeneous integration, MEMS packaging, acoustic wave devices and piezoelectric devices and materials.